AI-driven data centers evolve from single-chip to heterogeneous multi-GPU architectures. High-speed optical interconnects enable scalability, while silicon photonics and co-packaged optics boost bandwidth and energy efficiency amid modular, ecosystem-based competition. SCALE CPO solution is the industry's first OCI MSA capable platform and built with GF's proven silicon photonics technology MALTA, N., May 4, 2026 – GlobalFoundries (Nasdaq: GFS) (GF) today announced the introduction of its SCALE™ optical module solution for co-packaged optics (CPO). GF's SCALE. At OFC 2026, one signal became clear: interconnect is no longer a supporting component—it is becoming core infrastructure for AI systems. 6T comparison, next-gen interconnects are reshaping AI cluster design. The rapid growth of AI workloads—driven by large language models and large-scale GPU clusters—is pushing data center interconnects to their limits. Network bandwidth is moving quickly from 400G to. Industry focus at the Optical Fiber Communications Conference has shifted from telecommunications to data center artificial intelligence, according to observations from Semiengineering.
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